Sputtering Target Bonding Products Piezo electric Single Crystal Wafers and substrates
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USA
- USA
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- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 10 - Aug 15
Live Spec
Sputtering Target Bonding Products Piezo electric Single Crystal Wafers and substratesRectangular and Round Sputtering Target Bonding services offered. Backing plate designed and fabricated as per your specifications. Material: OFHC copper, Standard round Cu backing plate discs are 0. 125 in thickness. Backing plate diameter is 3 8" larger than Target diameter Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding Send us your CAD drawing for a quote Order with needed Sputter targets Price
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